AMD Planet

LE RAM E RELATIVE LATENZE E CHIP...

A-Data
-PC2700 (cl2,5) could be Winbond AH-6 or BH-6
-PC3200 Winbond CH-5, Samsung TCCC
-PC3200 Special Edition Winbond BH-5
-PC3700 (non Vitesta, no HS) should Samsung TCC5
-PC4000 (3-4-4-8 ) Hynix D43, D5, Samsung TCCC
-PC4000 Vitesta (3-4-4-8 ) Hynix D43, D5
-PC4500 Vitesta Samsung TCCD PC4800 Vitesta Hynix B
Apacer
-PC2700 could be Winbond AH-6 Buffalo
-PC3200 may or may not contain Micron 46V32M8 -5B C, 46V32M8 - 5B G look at the chips
-PC3700 may or may not contain Winbond BH-5, CH-5, Micron 46V32M8 -5B C look at the chips FireStix
-PC4000 Hynix B
Buffalo
-PC3200 may or may not contain Micron 46V32M8 -5B C, 46V32M8 - 5B G look at the chips
-PC3700 may or may not contain Winbond BH-5, CH-5, Micron 46V32M8 -5B C look at the chips
-FireStix PC4000 Hynix B
-FireStix PC3200 CL2 (2-2-2-4) Samsung TCCD
Centon
-Advanced DDR Samsung TCCD
-New Advanced DDR533 (3-4-4-8 ) Hynix D5
-New Advanced DDR400 (2-2-2-5) Samsung TCCD
Corsair
-XMS-PC2700C2 Rev1.1 (2-3-3-6-1T) maybe Winbond BH-6/Samsung TCB3
-XMS-PC2700C2 Rev1.2 (2-3-3-6-1T) Winbond CH-6
-XMS-PC2700C2 Rev1.3 (2-3-3-6-1T) Mosel Vitelic (6ns?)
-XMS-PC2700C2 Rev2.1 (2-3-3-6-1T) Micron (6ns rev B)/Samsung TCB3
-XMS-PC2700LL Rev1.1 (2-2-2-6-1T) Winbond BH-6
-XMS-PC2700LL Rev1.2 (2-2-2-6-1T) Winbond CH-6
-XMS-PC3000C2 Rev1.1 (2-3-3-6-1T) Samsung TCB3/Micron (6ns rev B) and few Winbond BH-6
-XMS-PC3000C2 Rev2.1 (2-3-3-6-1T) should Winbond BH-6
-XMS-PC3200C2 Rev1.0 (2-3-3-6-1T) Winbond CH-5
-XMS-PC3200C2 Rev1.1/2.1 (2-3-3-6-1T) Winbond BH-6
-XMS-PC3200C2 Rev1.2/2.2 (2-3-3-6-1T) Winbond CH-6
-XMS-PC3200C2 Rev3.1 (2-3-3-6-1T) Infineon B-5
-XMS-PC3200C2 Rev4.1 (2-3-3-6-1T) Samsung TCCD
-XMS-PC3200C2 Rev4.2 (2-3-3-6-1T) Samsung TCCD & TCC5
-XMS-PC3200LL Rev1.1/2.1 (2-2-2-6-1T) Winbond BH-5
-XMS-PC3200LL Rev1.2/2.2 (2-3-2-6-1T) Winbond CH-5
-XMS-PC3200LL Rev3.1 (2-3-2-6-1T) Infineon B-5
-XMS-PC3200XL Rev1.1 (2-2-2-5-1T) Samsung TCCD
-XMS-PC3500C2 Rev1.1 (2-3-3-7-1T) Winbond BH-5
-XMS-PC3700 Rev1.1(3-4-4-8-1T) Samsung TCCC
-XMS-PC4000 Rev1.1 (3-4-4-8-1T) Hynix D43
-XMS-PC4400 Rev1.1 (3-4-4-8-1T) Hynix D5
Crucial
-PC3200 may or may not contain Micron 46V32M8 -5B C, 46V32M8 -5B G
-Ballistix PC3200 (2-2-2-8 ) Micron 46V32M8 -5B G (maybe overlabeled)
-Ballistix PC4000 (2.5-4-4-8 ) Micron 46V32M8 -5B G (maybe overlabeled)
GeIL
-Value PC3200 Blue (2.5-3-3-6) Infineon 5ns, Hynix D5, D43
-Golden Dragon PC3200 (2-3-3-6-1T) WLCSP chip package w/ Samsung chips
-Ultra Platinum PC3200 (2-3-3-6-1T) Winbond CH-5, Mosel Vitelic 5ns
-Ultra X PC3200 (2-2-2-5-1T) Samsung TCCD (relabeled)
-Ultra X PC3200 (2-2-2-5-1T) Winbond UTT (new)
-Golden Dragon PC3500 (2.5-3-3-6-1T) WLCSP chip package w/ Samsung chips
-Ultra Platinum PC3500 (2.5-3-3-6-1T) Winbond CH-5, Mosel Vitelic 5ns
-Golden Dragon PC3700 (2.5-4-4-7-1T) WLCSP chip package w/ Samsung chips
-Golden Dragon PC4000 (2.5-4-4-7-1T) WLCSP chip package w/ Samsung chips
-Ultra Platinum PC4000 (3-4-4-8-1T) Hynix D43
-Ultra Platinum PC4200 (3-4-4-8-1T) Hynix D43
-Ultra Platinum PC4400 (3-4-4-8-1T) Hynix D5
G.Skill
G.SKILL PC3200(DDR400 1T) (2-2-2-5 1T), (F1-3200BWU2-512MBGH/1GBGH) Winbond UTT
G.SKILL PC4800(DDR600 1T) (2.5-4-4- 8 1T), PC3200 (2-2-2-5), (F1-3200DSU2-512FF/1GBFF) Samsung TCCD (new production)
G.SKILL PC4400(DDR550) (2.5-4-4-8 ), PC3200 (2-2-2-5) 1GB Kit (F1-3200DSU2-512LC/1GBLC) Samsung TCCD
G.SKILL PC4400(DDR550) (2.5-3-3-7), PC3200 (2-2-2-5) 512M Kit (F1-3200DSU2-512LE/1GBLE) Samsung TCCD (new production)
G.SKILL PC4800(DDR600) (2.5-4-4-8 ), PC3200 (2-2-2-5) (F1-3200DSU2-512LA/1GBLA) Samsung TCCD (new production)
G.SKILL PC4400(DDR550) (2.5-4-4-8 ), PC3200 (2-3-3-6) (F1-3200DSU2-512LD/1GBLD) Samsung TCCD
Kingmax
DDR PC2700 (2.5) TinyBGA
DDR PC3200 (2.5) TinyBGA
Hardcore PC4000 TSOP (3-4-4-8-1T) --chip--> Hynix D5
Kingston
-HyperX PC2700 (2-2-2-5-1T) (KHX 2700) first Samsung TCB3, then Winbond BH-6, CH-6, CH-5, relabeled unknown Chips.
-HyperX PC3000 (2-2-2-6-1T) (KHX 3000) first Samsung TCB3, then mainly Winbond BH-5, some BH-6, CH-5, CH-6 (maybe relabeled)
-HyperX PC 3200 (old revision, not AK2, K2 or A) (KHX 3200) Winbond BH-5
-HyperX PC 3200K2 (2-2-2-6-1T) (KHX 3200K2) Winbond BH-5
-HyperX PC 3200AK2 (2-3-2-6-1T) (KHX 3200AK2) Winbond CH-5
-HyperX PC 3200ULK2 (2-2-2-5-1T) (KHX 3200ULK2) Samsung TCCD
-HyperX PC 3500 (rated 2-3-3-7 @ 433Mhz, 2-2-2-6 @ 400Mhz, old revision) (KHX 3500) Winbond BH-5 (maybe relabeled)
-HyperX PC 3500K2 (2-3-3-7) (KHX 3500K2) Winbond CH-5
-HyperX PC 4000K2 (3-4-4-8 ) (KHX 4000K2) Samsung TCCC, Hynix D43, D5
-HyperX PC 4300K2 (3-4-4-8 ) (KHX 4300K2) Hynix D5
-Kingston Ram w/remarked Chips as D328DW-45 Before Week 18 Year 03 Winbond BH-5, after CH-5 (18 03 can be both)
-Kingston Ram w/remarked Chips as D328DW-5 Winbond BH-5
-Kingston Ram w/remarked Chips as D328DW-6 Winbond BH-6
-Kingston Ram w/remarked Chips as D328DM-6 should Winbond BH-6
-Kingston Ram w/remarked Chips as D328DM-5 should Winbond BH-5
-Value Ram 333Mhz (2,5-3-3-*) (KVR333X64C25) may or may not contain Winbond BH-6, AH-6, Hynix D43, D5 look at the chips (maybe relabeled)
-Value Ram 400Mhz (2,5-3-3-*) (KVR400X64C25) may or may not contain Winbond BH-5, CH-5, Micron 46V32M8 -5B C, Hynix D43, D5, Samsung TCCC, TCC4 look at the chips (maybe relabeled)
Mushkin
-PC2700 (Non Level X, rated 2-3-3, Promo-Build) Winbond CH-6
-PC3200 Cl2,5 (Non Level X, non Blue, non Green Serie) Winbond BH-5, Samsung TCB3
-PC3200 (Non Level X, rated 2-2-2, Promo-Build) Winbond BH-5
-PC3200 Level I (2-3-2) Winbond CH-5
-PC3200 Level II (2-2-2) Winbond BH-5 or BH-6
-PC3200 Special 2-2-2 Winbond BH-6
-PC3200 Level II V2 (2-2-2) Samsung TCCD
-PC3200 BLUE CL2 (2-3-3-X) Winbond UTT
-PC3500 Level I (2-3-3) Winbond CH-5
-PC3500 Level II (2-2-2) Winbond BH-5
OCZ
-EL DDR PC3200 Platinum Limited Edition (2-2-2-7) Winbond BH-6
-EL DDR PC3200 Platinum Edition (2-3-2-5) Samsung TCB3, ProMOS 5ns (relabeled), Mosel Vitelic 5ns (relabeled), Winbond CH-5
-EL DDR PC3200 Platinum Edition (2-3-2-5) OCZ4001024ELDCPE-K Infineon
-EB DDR PC3200 Platinum Edition (2,5-3-2-8 ) Micron 46V32M8 -5B C
-EL DDR PC3200 Platinum Edition rev2 (2-2-2-6) Samsung 4ns TCCD
-EL DDR PC3500 Platinum Limited Edition (2-2-3-6) Winbond BH-5
-EL DDR PC3500 Platinum Edition (2-3-2-5) Winbond CH-5, few BH-5
-EB DDR PC3500 Platinum Edition (2,5-3-2-8 ) Micron 46V32M8 -5B C
-EL DDR PC3700 Gold Edition rev1 (2-3-3-7) Samsung TCB3 (overlabeled)
-EL DDR PC3700 Gold Edition rev2 (2,5-3-3-7) ProMOS 5ns (relabeled) , Mosel Vitelic 5ns (relabeled)
-EB DDR PC3700 Platinum Edition (3-2-2-8/3-3-2-8 ) Micron 46V32M8 -5B C
-DDR PC4000 (3-4-4-8 ) Hynix D5, D43 (relabeled)
-DDR PC4200 (3-4-4-8 ) Hynix D5, D43
-DDR PC4400 (3-4-4-8 ) Hynix D5 EL
-DDR PC4400 Gold Edition (2,5-4-4-8 ) Hynix B
-EL DDR PC4400 Gold Edition (2,5-4-4-8 ) Hynix B, Samsung TCCD
-EL PC4800 Platinum Edition (2,5-4-4-10 1T/2T) Samsung TCCD (new )
Samsung
-PC3200 Samsung TCC4, TCCC
-PC3700 Samsung TCC5
-PC4000 CL3 Samsung TCCD
Shikatronics
-ShikaXram PC4400 (3-4-4-8 ) Hynix B
TwinMos
-Twinmos DDR333 (2,5-3-3-6) Samsung TCB3, TCC4 Winbond AH-6, Winbond BH-6, Twinmos, Hynix, Mtec
-Twinmos/Winbond DDR400 (2,5-3-3-6) Could be Winbond BH-5, CH-5, look at the chips
-Twinmos Twisters DDR500 (TSOP) (3-4-4-8 ) Hynix D43, Samsung TCCC
-Twinmos Twisters DDR533 (3-4-4-8 ) Hynix D5
-TwisterPro PC3700/DDR466 (2,5-3-3-7) Samsung TCCD
-Speed Premium PC3500 (DDR433) (2,5-3-3-8 ) Winbond New BH-5
Ultra
-Extreme Memory PC3200 DDR 400MHZ (2-2-2-5-1T) Winbond BH-5, selected CH-5

AGGIORNAMENTO DA EFFETTUARE PERIODICAMENTE (GHOST)

Bravo ghost.

Ma le latenze sono riferite a 200 Mhz o alla frequenza massima delle ram?

sn definite a quanto dichiara la casa madre @ v. default alle frequenze indicate...

XMS-PC3200C2 Rev1.2/2.2 (2-3-3-6-1T) Winbond CH-6

quando comprai le corsair mi volevano vendere queste dicendo che erano bh5... le presi tutte e due senza pagare le corsair...

-Value Ram 400Mhz (2,5T-3-3-*) (KVR400X64C25) a me sono capitate con Chip Mosel (V58C2256804SAT5B)
Sono montati anche sulle KingMAX. Sono davvero rognose all'inizio.
Di default vanno settate a 2.5T-3-3-8.
Con bios moddato ho impostato le ram a 2T-3-3-6 a 200Mhz in Dual Channel.

Saluti. 8)

ma siamo sicuri che tutte le vitesta 566 montano samsung tccd? le mie (dicono nei forum) sembrano essere delle utt...

uhm..non penso le utt volgiono voltaggi un po' più alti e non reggerebbero a quelle frequenze con solo 2,8v

Nokia-xp ha scritto:ma siamo sicuri che tutte le vitesta 566 montano samsung tccd? le mie (dicono nei forum) sembrano essere delle utt...

Ciao nokia!
Beh...prova 240 5-2-2-2 @ 3,2v,lo scoprirai subito!
Cmq dubito che siano utt...puoi anche rimuovere il dissi e costatare direttamente se sono tccd e la sigla dei tccd che montano,scritta accanto a TCCD!

Ciao...

Hei ghost,ottima idea questa della lista dei chip...

Cmq ci sono delle geil ultra-x pc3200 che montano winbond utt,le ho montate su una dfi ultra-d e reggevano 250 5-2-2-2 @ 3,2 volt!

Ciao...

aggiungiamo ^_^ e grazie

Ghost ha scritto:aggiungiamo ^_^ e grazie

.....e di che!
Ciao.

Ma queste ram sono bh5 ?


Corsair TWINX 1024-3200XL

non mi va di smontare il dissi, so solo che 250mhz con quelle latenze... mah

qualcuno mi sa dire che chip montano le Corsair CMX512 3200C XMS3202v1.5?

Salve a tutti, dato che qui si parla di RAM posto qui la mia domanda: chi è che saprebbe spiegarmi l'esatto significato (oppure quello che crede che sia) dei parametri di una RAM?
Comprare un DDR2 con CL4 che costa poco è un affare o è meglio spendere qualcosa in più per una DDR2 con CL inferiore? Portare a valori inferiori il valore di CL può procurare danni alla RAM oppure causa semplicemente una instabilità del sistema?

Grazie a tutti quelli che risponderanno