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RAM LISTING:
A-Data
PC2700 (cl2,5) --chip--> could be Winbond AH-6 or BH-6
PC3200 --chip--> Winbond CH-5, Samsung TCCC
PC3200 --chip--> Special Edition Winbond BH-5
PC3700 (non Vitesta, no HS) --chip--> should Samsung TCC5
PC4000 (3-4-4- otto) --chip--> Hynix D43, D5, Samsung TCCC
PC4000 Vitesta DDR500 (3-4-4-otto) --chip--> Hynix D43, D5 or Samsung TCCD (few)
PC4500 Vitesta DDR566 --chip--> Samsung TCCD - Modified JEDEC PCB or Hynix B (few)
PC4800 Vitesta DDR600 --chip--> Samsung TCCD - Modified JEDEC PCB or Hynix B

Apacer
PC2700 --chip--> could be Winbond AH-6
PC4000 --chip--> Samsung TCCD

Buffalo
PC3200 --chip--> may or may not contain Micron 46V32M8 -5B C, 46V32M8 - 5B G look at the chips
PC3700 --chip--> may or may not contain Winbond BH-5, CH-5, Micron 46V32M8 -5B C look at the chips
FireStix PC4000 --chip--> Hynix B

Centon
Advanced DDR --chip--> Samsung TCCD
New Advanced DDR533 (3-4-4-otto) --chip--> Hynix D5
New Advanced DDR400 (2-2-2-5) --chip--> Samsung TCCD ~ Brainpower PCB

Corsair
XMS-PC2700C2 Rev1.1 (2-3-3-6-1T) --chip--> maybe Winbond BH-6/Samsung TCB3
XMS-PC2700C2 Rev1.2 (2-3-3-6-1T) --chip--> Winbond CH-6
XMS-PC2700C2 Rev1.3 (2-3-3-6-1T) --chip--> Mosel Vitelic (6ns?)
XMS-PC2700C2 Rev2.1 (2-3-3-6-1T) --chip--> Micron (6ns rev B)/Samsung TCB3
XMS-PC2700LL Rev1.1 (2-2-2-6-1T) --chip--> Winbond BH-6
XMS-PC2700LL Rev1.2 (2-2-2-6-1T) --chip--> Winbond CH-6
XMS-PC3000C2 Rev1.1 (2-3-3-6-1T) --chip--> Samsung TCB3/Micron (6ns rev B) and few Winbond BH-6
XMS-PC3000C2 Rev2.1 (2-3-3-6-1T) --chip--> should Winbond BH-6
XMS-PC3200C2 Rev1.0 (2-3-3-6-1T) --chip--> Winbond CH-5
XMS-PC3200C2 Rev1.1/2.1 (2-3-3-6-1T) --chip--> Winbond BH-6
XMS-PC3200C2 Rev1.2/2.2 (2-3-3-6-1T) --chip--> Winbond CH-6
XMS-PC3200C2 Rev3.1 (2-3-3-6-1T) --chip--> Infineon B-5
XMS-PC3200C2 Rev4.1 (2-3-3-6-1T) --chip--> Samsung TCCD
XMS-PC3200C2 Rev4.2 (2-3-3-6-1T) --chip--> Samsung TCCD & TCC5
XMS-PC3200C2 Rev5.1 (2-3-3-6-1T) --chip--> Mosel Vitelic 5ns
XMS-PC3200LL Rev1.1/2.1 (2-2-2-6-1T) --chip--> Winbond BH-5
XMS-PC3200LL Rev1.2/2.2 (2-3-2-6-1T) --chip--> Winbond CH-5
XMS-PC3200LL Rev3.1 (2-3-2-6-1T) --chip--> Infineon B-5
XMS-PC3200XL/XLPT Rev1.1 (2-2-2-5-1T) --chip--> Samsung TCCD
XMS-PC3200XL/XLPT Rev1.2 (2-2-2-5-1T) --chip--> Samsung TCCD ~ Brainpower PCB
XMS-PC3500C2 Rev1.1 (2-3-3-7-1T) --chip--> Winbond BH-5
XMS-PC3700 Rev1.1(3-4-4-otto-1T) --chip--> Samsung TCCC
XMS-PC4000 Rev1.1 (3-4-4-otto-1T) --chip--> Hynix D43
XMS-PC4400 Rev1.1 (3-4-4-otto-1T) --chip--> Hynix D5
XMS-PC4400C25 (2.5-4-4-otto-1T) --chip--> Samsung TCCD ~ Brainpower PCB

Crucial
PC3200 --chip--> may or may not contain Micron 46V32M8 -5B C, 46V32M8 -5B G
Ballistix PC3200 (2-2-2-otto) --chip--> Micron 46V32M8 -5B G (maybe overlabeled)
Ballistix PC4000 (2.5-4-4-otto) --chip--> Micron 46V32M8 -5B G (maybe overlabeled)

GeIL
Value PC3200 Blue (2.5-3-3-6) --chip--> Infineon 5ns, Hynix D5, D43
Golden Dragon PC3200 (2-3-3-6-1T) --chip--> WLCSP chip package w/ Samsung chips
Ultra Platinum PC3200 (2-3-3-6-1T) --chip--> Winbond CH-5, Mosel Vitelic 5ns
Ultra-X PC3200\PC4000\PC4400 (2-2-2-5\2,5-3-3-5\2,5-4-4-7 -1T) --chip--> Samsung TCCD (hand-picked, relabeled) ~ Brainpower PCB
Golden Dragon PC3500 (2.5-3-3-6-1T) --chip--> WLCSP chip package w/ Samsung chips
Ultra Platinum PC3500 (2.5-3-3-6-1T) --chip--> Winbond CH-5, Mosel Vitelic 5ns
Golden Dragon PC3700 (2.5-4-4-7-1T) --chip--> WLCSP chip package w/ Samsung chips
Golden Dragon PC4000 (2.5-4-4-7-1T) --chip--> WLCSP chip package w/ Samsung chips
Ultra Series PC3200 (2-3-3-6-1T) --chip--> Samsung TCC5
Ultra Platinum PC4000 (3-4-4-otto-1T) --chip--> Hynix D43
Ultra Platinum PC4200 (3-4-4-otto-1T) --chip--> Hynix D43
Ultra Platinum PC4400 (3-4-4-otto-1T) --chip--> Hynix D5

G.Skill
G.SKILL PC4400(DDR550) (2.5-4-4-otto), PC3200 (2-2-2-5) 1GB Kit (F1-3200DSU2-512LC/1GBLC) --chip--> Samsung TCCD ~ Brainpower PCB
G.SKILL PC4400(DDR550) (2.5-3-3-7), PC3200 (2-2-2-5) 512M Kit (F1-3200DSU2-512LE/1GBLE) --chip--> Samsung TCCD (new production ?) ~ Brainpower PCB
G.SKILL PC4800(DDR600) (2.5-4-4-otto), PC3200 (2-2-2-5) (F1-3200DSU2-512LA/1GBLA) --chip--> Samsung TCCD (new production) ~ Brainpower PCB
G.SKILL PC4400(DDR550) (2.5-4-4-otto), PC3200 (2-3-3-6) (F1-3200DSU2-512LD/1GBLD) --chip--> Samsung TCCD ~ Brainpower PCB

Kingston
HyperX PC2700 (2-2-2-5-1T) (KHX 2700) --chip--> first Samsung TCB3, then Winbond BH-6, CH-6, CH-5, relabeled unknown Chips.
HyperX PC3000 (2-2-2-6-1T) (KHX 3000) --chip--> first Samsung TCB3, then mainly Winbond BH-5, some BH-6, CH-5, CH-6 (maybe relabeled)
HyperX PC 3200 (old revision, not AK2, K2 or A) (KHX 3200) --chip--> Winbond BH-5
HyperX PC 3200K2 (2-2-2-6-1T) (KHX 3200K2) --chip--> Winbond BH-5
HyperX PC 3200AK2 (2-3-2-6-1T) (KHX 3200AK2) --chip--> Winbond CH-5
HyperX PC 3200ULK2 (2-2-2-5-1T) (KHX 3200ULK2) --chip--> Samsung TCCD
HyperX PC 3500 (rated 2-3-3-7 @ 433Mhz, 2-2-2-6 @ 400Mhz, old revision) (KHX 3500) --chip--> Winbond BH-5 (maybe relabeled)
HyperX PC 3500K2 (2-3-3-7) (KHX 3500K2) --chip--> Winbond CH-5
HyperX PC 4000K2 (3-4-4-otto) (KHX 4000K2) --chip--> Samsung TCCC, Hynix D43, D5
HyperX PC 4300K2 (3-4-4-otto) (KHX 4300K2) --chip--> Hynix D5
Kingston Ram w/remarked Chips as D328DW-45 --chip--> Before Week 18 Year 03 Winbond BH-5, after CH-5 (18 03 can be both)
Kingston Ram w/remarked Chips as D328DW-5 --chip--> Winbond BH-5
Kingston Ram w/remarked Chips as D328DW-6 Winbond BH-6
Kingston Ram w/remarked Chips as D328DM-6 --chip--> should Winbond BH-6
Kingston Ram w/remarked Chips as D328DM-5 --chip--> should Winbond BH-5
Value Ram 333Mhz (2,5-3-3-*) (KVR333X64C25) --chip--> may or may not contain Winbond BH-6, AH-6, Hynix D43, D5 look at the chips (maybe relabeled)
Value Ram 400Mhz (2,5-3-3-*) (KVR400X64C25) --chip--> may or may not contain Winbond BH-5, CH-5, Micron 46V32M8 -5B C, Hynix D43, D5, Samsung TCCC, TCC4 look at the chips (maybe relabeled)

Mushkin
PC2700 (Non Level X, rated 2-3-3, Promo-Build) --chip--> Winbond CH-6
PC3200 Cl2,5 (Non Level X, non Blue, non Green Serie) --chip--> Winbond BH-5, Samsung TCB3
PC3200 (Non Level X, rated 2-2-2, Promo-Build) --chip--> Winbond BH-5
PC3200 Level I (2-3-2) --chip--> Winbond CH-5
PC3200 Level II (2-2-2) --chip--> Winbond BH-5 or BH-6
PC3200 Special 2-2-2 --chip--> Winbond BH-6
PC3200 Level II V2 (2-2-2) --chip--> Samsung TCCD
PC3500 Level I (2-3-3) --chip--> Winbond CH-5
PC3500 Level II (2-2-2) --chip--> Winbond BH-5
PC3700 (2,5-4-3) --chip--> Samsung TCCD (rev. F)
PC4400 (2,5-4-4) --chip--> Samsung TCCD (rev. F) ~ Brainpower PCB

OCZ
EL DDR PC3200 Platinum Limited Edition (2-2-2-7) --chip--> Winbond BH-6
EL DDR PC3200 Platinum Edition (2-3-2-5) --chip--> Samsung TCB3, ProMOS 5ns (relabeled), Mosel Vitelic 5ns (relabeled), Winbond CH-5
EB DDR PC3200 Platinum Edition (2,5-3-2-otto) --chip--> Micron 46V32M8 -5B C
EL DDR PC3200 Platinum Edition rev2 (2-2-2-5) --chip--> Samsung 4ns TCCD ~ Brainpower PCB
EL DDR PC3200 DC Gold VX (2-3-3-otto@2.6V | 2-2-2-v@3.2V) --chip--> Windond UTT (relabeled as OCZ Voltage eXtreme) ~ Brainpower PCB 808
EL DDR PC3500 Platinum Limited Edition (2-2-3-6) --chip--> Winbond BH-5
EL DDR PC3500 Platinum Edition (2-3-2-5) --chip--> Winbond CH-5, few BH-5
EB DDR PC3500 Platinum Edition (2,5-3-2-otto) --chip--> Micron 46V32M8 -5B C
EL DDR PC3700 Gold Edition rev1 (2-3-3-7) --chip--> Samsung TCB3 (overlabeled)
EL DDR PC3700 Gold Edition rev2 (2,5-3-3-7) --chip--> ProMOS 5ns (relabeled) , Mosel Vitelic 5ns (relabeled)
EL DDR PC3700 Gold Edition rev3 (2,5-3-3-otto) --chip--> Hynix DT-D5 ~ Brainpower PCB 808
EB DDR PC3700 Platinum Edition (3-2-2-otto/3-3-2-otto) --chip--> Micron 46V32M8 -5B C
DDR PC4000 (3-4-4-otto) --chip--> Hynix D5, D43 (relabeled)
DDR PC4200 (3-4-4-otto) --chip--> Hynix D5, D43
DDR PC4400 (3-4-4-otto) --chip--> Hynix D5
EL DDR PC4400 Gold Edition (2,5-4-4-otto) --chip--> Hynix B

OC-Wear
OC-WearDDR PC3200 (2-3-3-6) - DDR560 CL 3-4-4-otto @ 2,8V --chip--> Samsung TCCD

Patriot (incomplete)
Patriot PDC5123200+XBLK\PDC1G3200+XBLK (2-2-2-5) --chip--> Samsung TCCD ~ Brainpower PCB

PQI (incomplete)
PQI Turbo Memory DC PC3200 (2-2-2-5) --chip--> Samsung TCCD ~ Brainpower PCB
PQI Turbo Memory DC PC4000 (2,5-3-3-7) --chip--> Samsung TCCD ~ Brainpower PCB

Samsung
PC3200 --chip--> Samsung TCC4, TCCC
PC3700 --chip--> Samsung TCC5
PC4000 --chip--> CL3 Samsung TCCD

Shikatronics
ShikaXram PC4400 (3-4-4-otto) --chip--> Hynix B

TwinMos
Twinmos DDR333 (2,5-3-3-6) --chip--> Samsung TCB3, TCC4 Winbond AH-6, Winbond BH-6, Twinmos, Hynix, Mtec
Twinmos/Winbond DDR400 (2,5-3-3-6) --chip--> Could be Winbond BH-5, CH-5, look at the chips
Twinmos Twisters DDR500 (TSOP) (3-4-4-otto) --chip--> Hynix D43, Samsung TCCC
Twinmos Twisters DDR533 (3-4-4-otto) --chip--> Hynix D5
TwisterPro PC3200/DDR400 (2-2-2-5) --chip--> Samsung TCCD

Twinmos with Winbond UTT (relabeled as Twinmos\M.Tec) <--chip--
(*) Twinmos SpeedPremium (after week 46/2004 with UTT & BP PCB)
(*) Two Dots marking
(*) AA4T (not AADT)
(*) Metal Dots (two in each side!)
(*) 44D (or 50D) TMD marking (some 60D PC2700 too)

Ultra
Extreme Memory PC3200 DDR 400MHZ (2-2-2-5-1T) --chip--> Winbond BH-5, selected CH-5

? = Need more input
Modified JEDEC (Reference) PCB/Brainpower PCB = Ehnanced PCBs (+5/10 Mhz)

SAMSNUG TCCD RAM CLASSIFICATION based on review, comments, posts, etc. (it is ABSOLUTELY indicative and of course it is not scientific because a lot depends on chip luck):


+~300 Mhz:
G.SKILL PC4800(DDR600) (2.5-4-4-otto), PC3200 (2-2-2-5) (F1-3200DSU2-512LA/1GBLA) ~ Brainpower PCB
^ "Puni's Choice" (best TCCD in in the market, agile and powerful, "300 Mhz" are past)

G.SKILL PC4400(DDR550) (2.5-3-3-7 ) PC3200 (2-2-2-5) 512M Kit (F1-3200DSU2-512LE/1GBLE) ~ Brainpower PCB
OCZ EL DDR PC3200 Platinum Edition rev2 (2-2-2-5) ~ Brainpower PCB
GeIL Ultra-X PC3200\PC4000\PC4400 (2-2-2-5\2,5-3-3-5\2,5-4-4-7 -1T) ~ Brainpower PCB
Mushkin PC4400 (2,5-4-4) --chip--> Samsung TCCD (rev. F) ~ Brainpower PCB
New Centon Advanced DDR ~ Brainpower PCB
A-Data PC4800/PC4500 Vitesta DDR600/DDR566 - Modified JEDEC PCB

~-300 Mhz:
G.SKILL PC4400(DDR550) (2.5-4-4-otto), PC3200 (2-2-2-5) 1GB Kit (F1-3200DSU2-512LC/1GBLC) ~ Brainpower PCB
Corsair XMS-PC4400C25 (2.5-4-4-otto-1T) --chip--> Samsung TCCD ~ Brainpower PCB
Corsair XMS-PC3200XL Rev1.2/XLPT (2-2-2-5-1T) ~ Brainpower PCB
Corsair XMS-PC3200XL Rev1.1 (2-2-2-5-1T)
G.SKILL PC4400(DDR550) (2.5-4-4- 8 ), PC3200 (2-3-3-6) (F1-3200DSU2-512LD/1GBLD) ~ Brainpower PCB
Mushkin PC3700 (2,5-4-3) --chip--> Samsung TCCD (rev. F)
PQI Turbo Memory DC PC4000 (2,5-3-3-7) --chip--> Samsung TCCD ~ Brainpower PCB
Samsung PC4000
PQI Turbo Memory DC PC3200 (2-2-2-5) ~ Brainpower PCB
Patriot PDC5123200+XBLK\PDC1G3200+XBLK (2-2-2-5) ~ Brainpower PCB
Corsair XMS-PC3200C2 Rev4.1 (2-3-3-6-1T)
OC-WearDDR PC3200 - DDR560 CL 3-4-4-otto @ 2,8V

-300 Mhz:
Mushkin PC3200 Level II V2 (2-2-2)
TwisterPro PC3200/DDR400 (2-2-2-5)
HyperX PC 3200ULK2 (2-2-2-5-1T) (KHX 3200ULK2)
Apacer PC4000
Centon Advanced DDR


"+~300 Mhz" = for sure over 300 Mhz, except rarity.
"~-300 Mhz" = around 300 Mhz, largely under 300 Mhz.
"-300 Mhz" = under 300 Mhz of about 5*(2,)3,4,5(,6) Mhz except rarity.

With V-RAM ~2,85V and relaxed timings.



Winbond UTT vs TCCD (indicative comparison, not scientific):

Low Timings 2-2-2-X:
Winbond UTT (265-270 Mhz 1T @ ~3,4V) > TCCD (235-240 Mhz 1T @ ~2,85V)

Medium Timings 2,5-3-3-X:
TCCD (~300 Mhz 1T @ 2,85V) > Winbond UTT (270-275 Mhz 1T @ 3,4V)

High Timings 3-4-4-X:
TCCD (+300 Mhz 1T/2T @ ~2,85V) > Winbond UTT (275-280 Mhz ~1T/2T @ 3,4V)

Consumption (max = at which voltage they give their max):
TCCD: ~2,85V (max)
Winbond UTT: +3,4V (max unknown)

se qualcuno e contro me lo dica che cancello tutto(dato che e un lavoro altrui)
be io lo metto
il lavoro e stato svolto da hardwareupgrade utente punisher e per correttezza ciaoz