Hammer: VIA e SiS ci anticipano qualcosa
VIA e SiS durante la giornata di ieri hanno rilasciato altre interessanti informazioni sui propri chipset che andranno a supportare il nuovo processore AMD codename "Hammer". Ecco un pezzo tratto da The Inquirer:
Digitimes says VIA will change its packaging procedure for all its Hammer-based products in favour of the lower-cost Ball-Grid Aarray (BGA) process, to reduce the cost of the products. The company will also rename its chipsets to incorporate a sexier-sounding 400 into the labelling mix. Thus the K8HTA, K8HTB and K8UMA chipsets become K8T400, K8T400M and K8M400, respectively.
SiS incorporates a Firewire interface, AGP 8x and USB 2.0 on the chipsets and has been beefing up its marketing plans with "aggressive" marketing cooperation deals with motherboard companies for various territories.
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