Ram..LATENZE e CHIP montati

[Ghost]

LE RAM E RELATIVE LATENZE E CHIP...

A-Data
-PC2700 (cl2,5) could be Winbond AH-6 or BH-6
-PC3200 Winbond CH-5, Samsung TCCC
-PC3200 Special Edition Winbond BH-5
-PC3700 (non Vitesta, no HS) should Samsung TCC5
-PC4000 (3-4-4-8 ) Hynix D43, D5, Samsung TCCC
-PC4000 Vitesta (3-4-4-8 ) Hynix D43, D5
-PC4500 Vitesta Samsung TCCD PC4800 Vitesta Hynix B
Apacer
-PC2700 could be Winbond AH-6 Buffalo
-PC3200 may or may not contain Micron 46V32M8 -5B C, 46V32M8 - 5B G look at the chips
-PC3700 may or may not contain Winbond BH-5, CH-5, Micron 46V32M8 -5B C look at the chips FireStix
-PC4000 Hynix B
Buffalo
-PC3200 may or may not contain Micron 46V32M8 -5B C, 46V32M8 - 5B G look at the chips
-PC3700 may or may not contain Winbond BH-5, CH-5, Micron 46V32M8 -5B C look at the chips
-FireStix PC4000 Hynix B
-FireStix PC3200 CL2 (2-2-2-4) Samsung TCCD
Centon
-Advanced DDR Samsung TCCD
-New Advanced DDR533 (3-4-4-8 ) Hynix D5
-New Advanced DDR400 (2-2-2-5) Samsung TCCD
Corsair
-XMS-PC2700C2 Rev1.1 (2-3-3-6-1T) maybe Winbond BH-6/Samsung TCB3
-XMS-PC2700C2 Rev1.2 (2-3-3-6-1T) Winbond CH-6
-XMS-PC2700C2 Rev1.3 (2-3-3-6-1T) Mosel Vitelic (6ns?)
-XMS-PC2700C2 Rev2.1 (2-3-3-6-1T) Micron (6ns rev B)/Samsung TCB3
-XMS-PC2700LL Rev1.1 (2-2-2-6-1T) Winbond BH-6
-XMS-PC2700LL Rev1.2 (2-2-2-6-1T) Winbond CH-6
-XMS-PC3000C2 Rev1.1 (2-3-3-6-1T) Samsung TCB3/Micron (6ns rev B) and few Winbond BH-6
-XMS-PC3000C2 Rev2.1 (2-3-3-6-1T) should Winbond BH-6
-XMS-PC3200C2 Rev1.0 (2-3-3-6-1T) Winbond CH-5
-XMS-PC3200C2 Rev1.1/2.1 (2-3-3-6-1T) Winbond BH-6
-XMS-PC3200C2 Rev1.2/2.2 (2-3-3-6-1T) Winbond CH-6
-XMS-PC3200C2 Rev3.1 (2-3-3-6-1T) Infineon B-5
-XMS-PC3200C2 Rev4.1 (2-3-3-6-1T) Samsung TCCD
-XMS-PC3200C2 Rev4.2 (2-3-3-6-1T) Samsung TCCD & TCC5
-XMS-PC3200LL Rev1.1/2.1 (2-2-2-6-1T) Winbond BH-5
-XMS-PC3200LL Rev1.2/2.2 (2-3-2-6-1T) Winbond CH-5
-XMS-PC3200LL Rev3.1 (2-3-2-6-1T) Infineon B-5
-XMS-PC3200XL Rev1.1 (2-2-2-5-1T) Samsung TCCD
-XMS-PC3500C2 Rev1.1 (2-3-3-7-1T) Winbond BH-5
-XMS-PC3700 Rev1.1(3-4-4-8-1T) Samsung TCCC
-XMS-PC4000 Rev1.1 (3-4-4-8-1T) Hynix D43
-XMS-PC4400 Rev1.1 (3-4-4-8-1T) Hynix D5
Crucial
-PC3200 may or may not contain Micron 46V32M8 -5B C, 46V32M8 -5B G
-Ballistix PC3200 (2-2-2-8 ) Micron 46V32M8 -5B G (maybe overlabeled)
-Ballistix PC4000 (2.5-4-4-8 ) Micron 46V32M8 -5B G (maybe overlabeled)
GeIL
-Value PC3200 Blue (2.5-3-3-6) Infineon 5ns, Hynix D5, D43
-Golden Dragon PC3200 (2-3-3-6-1T) WLCSP chip package w/ Samsung chips
-Ultra Platinum PC3200 (2-3-3-6-1T) Winbond CH-5, Mosel Vitelic 5ns
-Ultra X PC3200 (2-2-2-5-1T) Samsung TCCD (relabeled)
-Ultra X PC3200 (2-2-2-5-1T) Winbond UTT (new)
-Golden Dragon PC3500 (2.5-3-3-6-1T) WLCSP chip package w/ Samsung chips
-Ultra Platinum PC3500 (2.5-3-3-6-1T) Winbond CH-5, Mosel Vitelic 5ns
-Golden Dragon PC3700 (2.5-4-4-7-1T) WLCSP chip package w/ Samsung chips
-Golden Dragon PC4000 (2.5-4-4-7-1T) WLCSP chip package w/ Samsung chips
-Ultra Platinum PC4000 (3-4-4-8-1T) Hynix D43
-Ultra Platinum PC4200 (3-4-4-8-1T) Hynix D43
-Ultra Platinum PC4400 (3-4-4-8-1T) Hynix D5
G.Skill
G.SKILL PC3200(DDR400 1T) (2-2-2-5 1T), (F1-3200BWU2-512MBGH/1GBGH) Winbond UTT
G.SKILL PC4800(DDR600 1T) (2.5-4-4- 8 1T), PC3200 (2-2-2-5), (F1-3200DSU2-512FF/1GBFF) Samsung TCCD (new production)
G.SKILL PC4400(DDR550) (2.5-4-4-8 ), PC3200 (2-2-2-5) 1GB Kit (F1-3200DSU2-512LC/1GBLC) Samsung TCCD
G.SKILL PC4400(DDR550) (2.5-3-3-7), PC3200 (2-2-2-5) 512M Kit (F1-3200DSU2-512LE/1GBLE) Samsung TCCD (new production)
G.SKILL PC4800(DDR600) (2.5-4-4-8 ), PC3200 (2-2-2-5) (F1-3200DSU2-512LA/1GBLA) Samsung TCCD (new production)
G.SKILL PC4400(DDR550) (2.5-4-4-8 ), PC3200 (2-3-3-6) (F1-3200DSU2-512LD/1GBLD) Samsung TCCD
Kingmax
DDR PC2700 (2.5) TinyBGA
DDR PC3200 (2.5) TinyBGA
Hardcore PC4000 TSOP (3-4-4-8-1T) --chip--> Hynix D5
Kingston
-HyperX PC2700 (2-2-2-5-1T) (KHX 2700) first Samsung TCB3, then Winbond BH-6, CH-6, CH-5, relabeled unknown Chips.
-HyperX PC3000 (2-2-2-6-1T) (KHX 3000) first Samsung TCB3, then mainly Winbond BH-5, some BH-6, CH-5, CH-6 (maybe relabeled)
-HyperX PC 3200 (old revision, not AK2, K2 or A) (KHX 3200) Winbond BH-5
-HyperX PC 3200K2 (2-2-2-6-1T) (KHX 3200K2) Winbond BH-5
-HyperX PC 3200AK2 (2-3-2-6-1T) (KHX 3200AK2) Winbond CH-5
-HyperX PC 3200ULK2 (2-2-2-5-1T) (KHX 3200ULK2) Samsung TCCD
-HyperX PC 3500 (rated 2-3-3-7 @ 433Mhz, 2-2-2-6 @ 400Mhz, old revision) (KHX 3500) Winbond BH-5 (maybe relabeled)
-HyperX PC 3500K2 (2-3-3-7) (KHX 3500K2) Winbond CH-5
-HyperX PC 4000K2 (3-4-4-8 ) (KHX 4000K2) Samsung TCCC, Hynix D43, D5
-HyperX PC 4300K2 (3-4-4-8 ) (KHX 4300K2) Hynix D5
-Kingston Ram w/remarked Chips as D328DW-45 Before Week 18 Year 03 Winbond BH-5, after CH-5 (18 03 can be both)
-Kingston Ram w/remarked Chips as D328DW-5 Winbond BH-5
-Kingston Ram w/remarked Chips as D328DW-6 Winbond BH-6
-Kingston Ram w/remarked Chips as D328DM-6 should Winbond BH-6
-Kingston Ram w/remarked Chips as D328DM-5 should Winbond BH-5
-Value Ram 333Mhz (2,5-3-3-*) (KVR333X64C25) may or may not contain Winbond BH-6, AH-6, Hynix D43, D5 look at the chips (maybe relabeled)
-Value Ram 400Mhz (2,5-3-3-*) (KVR400X64C25) may or may not contain Winbond BH-5, CH-5, Micron 46V32M8 -5B C, Hynix D43, D5, Samsung TCCC, TCC4 look at the chips (maybe relabeled)
Mushkin
-PC2700 (Non Level X, rated 2-3-3, Promo-Build) Winbond CH-6
-PC3200 Cl2,5 (Non Level X, non Blue, non Green Serie) Winbond BH-5, Samsung TCB3
-PC3200 (Non Level X, rated 2-2-2, Promo-Build) Winbond BH-5
-PC3200 Level I (2-3-2) Winbond CH-5
-PC3200 Level II (2-2-2) Winbond BH-5 or BH-6
-PC3200 Special 2-2-2 Winbond BH-6
-PC3200 Level II V2 (2-2-2) Samsung TCCD
-PC3200 BLUE CL2 (2-3-3-X) Winbond UTT
-PC3500 Level I (2-3-3) Winbond CH-5
-PC3500 Level II (2-2-2) Winbond BH-5
OCZ
-EL DDR PC3200 Platinum Limited Edition (2-2-2-7) Winbond BH-6
-EL DDR PC3200 Platinum Edition (2-3-2-5) Samsung TCB3, ProMOS 5ns (relabeled), Mosel Vitelic 5ns (relabeled), Winbond CH-5
-EL DDR PC3200 Platinum Edition (2-3-2-5) OCZ4001024ELDCPE-K Infineon
-EB DDR PC3200 Platinum Edition (2,5-3-2-8 ) Micron 46V32M8 -5B C
-EL DDR PC3200 Platinum Edition rev2 (2-2-2-6) Samsung 4ns TCCD
-EL DDR PC3500 Platinum Limited Edition (2-2-3-6) Winbond BH-5
-EL DDR PC3500 Platinum Edition (2-3-2-5) Winbond CH-5, few BH-5
-EB DDR PC3500 Platinum Edition (2,5-3-2-8 ) Micron 46V32M8 -5B C
-EL DDR PC3700 Gold Edition rev1 (2-3-3-7) Samsung TCB3 (overlabeled)
-EL DDR PC3700 Gold Edition rev2 (2,5-3-3-7) ProMOS 5ns (relabeled) , Mosel Vitelic 5ns (relabeled)
-EB DDR PC3700 Platinum Edition (3-2-2-8/3-3-2-8 ) Micron 46V32M8 -5B C
-DDR PC4000 (3-4-4-8 ) Hynix D5, D43 (relabeled)
-DDR PC4200 (3-4-4-8 ) Hynix D5, D43
-DDR PC4400 (3-4-4-8 ) Hynix D5 EL
-DDR PC4400 Gold Edition (2,5-4-4-8 ) Hynix B
-EL DDR PC4400 Gold Edition (2,5-4-4-8 ) Hynix B, Samsung TCCD
-EL PC4800 Platinum Edition (2,5-4-4-10 1T/2T) Samsung TCCD (new )
Samsung
-PC3200 Samsung TCC4, TCCC
-PC3700 Samsung TCC5
-PC4000 CL3 Samsung TCCD
Shikatronics
-ShikaXram PC4400 (3-4-4-8 ) Hynix B
TwinMos
-Twinmos DDR333 (2,5-3-3-6) Samsung TCB3, TCC4 Winbond AH-6, Winbond BH-6, Twinmos, Hynix, Mtec
-Twinmos/Winbond DDR400 (2,5-3-3-6) Could be Winbond BH-5, CH-5, look at the chips
-Twinmos Twisters DDR500 (TSOP) (3-4-4-8 ) Hynix D43, Samsung TCCC
-Twinmos Twisters DDR533 (3-4-4-8 ) Hynix D5
-TwisterPro PC3700/DDR466 (2,5-3-3-7) Samsung TCCD
-Speed Premium PC3500 (DDR433) (2,5-3-3-8 ) Winbond New BH-5
Ultra
-Extreme Memory PC3200 DDR 400MHZ (2-2-2-5-1T) Winbond BH-5, selected CH-5

AGGIORNAMENTO DA EFFETTUARE PERIODICAMENTE (GHOST)

[cb_123]

Bravo ghost.

Ma le latenze sono riferite a 200 Mhz o alla frequenza massima delle ram?

[Ghost]

sn definite a quanto dichiara la casa madre @ v. default alle frequenze indicate...

[Nokia-xp]

XMS-PC3200C2 Rev1.2/2.2 (2-3-3-6-1T) Winbond CH-6

quando comprai le corsair mi volevano vendere queste dicendo che erano bh5... le presi tutte e due senza pagare le corsair...

[geronimo73]

-Value Ram 400Mhz (2,5T-3-3-*) (KVR400X64C25) a me sono capitate con Chip Mosel (V58C2256804SAT5B)
Sono montati anche sulle KingMAX. Sono davvero rognose all'inizio.
Di default vanno settate a 2.5T-3-3-8.
Con bios moddato ho impostato le ram a 2T-3-3-6 a 200Mhz in Dual Channel.

Saluti. 8)

[Nokia-xp]

ma siamo sicuri che tutte le vitesta 566 montano samsung tccd? le mie (dicono nei forum) sembrano essere delle utt...

[gallomail]

uhm..non penso le utt volgiono voltaggi un po' più alti e non reggerebbero a quelle frequenze con solo 2,8v

[enzoexpo]

ma siamo sicuri che tutte le vitesta 566 montano samsung tccd? le mie (dicono nei forum) sembrano essere delle utt...

Ciao nokia!
Beh...prova 240 5-2-2-2 @ 3,2v,lo scoprirai subito!
Cmq dubito che siano utt...puoi anche rimuovere il dissi e costatare direttamente se sono tccd e la sigla dei tccd che montano,scritta accanto a TCCD!

Ciao...

[enzoexpo]

Hei ghost,ottima idea questa della lista dei chip...

Cmq ci sono delle geil ultra-x pc3200 che montano winbond utt,le ho montate su una dfi ultra-d e reggevano 250 5-2-2-2 @ 3,2 volt!

Ciao...

[Ghost]

aggiungiamo ^_^ e grazie

[enzoexpo]

aggiungiamo ^_^ e grazie

.....e di che!
Ciao.

[123456]

Ma queste ram sono bh5 ?


Corsair TWINX 1024-3200XL

[Nokia-xp]

non mi va di smontare il dissi, so solo che 250mhz con quelle latenze... mah

[jetli]

qualcuno mi sa dire che chip montano le Corsair CMX512 3200C XMS3202v1.5?

[The Grinder]

Salve a tutti, dato che qui si parla di RAM posto qui la mia domanda: chi è che saprebbe spiegarmi l'esatto significato (oppure quello che crede che sia) dei parametri di una RAM?
Comprare un DDR2 con CL4 che costa poco è un affare o è meglio spendere qualcosa in più per una DDR2 con CL inferiore? Portare a valori inferiori il valore di CL può procurare danni alla RAM oppure causa semplicemente una instabilità del sistema?

Grazie a tutti quelli che risponderanno